ELECTRICAL MODELING OF INTERCONNECTIONS IN MULTILAYER PACKAGING STRUCTURES

被引：11

作者：

PALUSINSKI, OA

LIAO, JC

TESCHAN, PE

PRINCE, JL

QUINTERO, F

机构：

[1] Univ of Arizona, Dep of Electr &, Comput Eng, Tucson, AZ, USA, Univ of Arizona, Dep of Electr & Comput Eng, Tucson, AZ, USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期

关键词：

D O I：

10.1109/TCHMT.1987.1134722

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：217 / 223

页数：7

共 7 条

[1] REFLECTION AND CROSSTALK IN LOGIC CIRCUIT INTERCONNECTIONS [J].

DEFALCO, JA .

[2]

HUGHS JJ, 1966, RCA REV, V27, P371

[3]

Jaswon M, 1977, INTEGRAL EQUATION ME, P287

[4]

PRINCE JH, COMMUNICATION

WEEKS, WT .

WHEELER, HA .

[7]

1979, LINPACK USERS GUIDE