MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF PB-FREE SOLDER ALLOYS FOR LOW-COST ELECTRONIC ASSEMBLY - A REVIEW

被引:275
作者
GLAZER, J
机构
[1] Electronic Assembly Development Center, Hewlett Packard Company, Palo Alto, 94303, CA
关键词
ELECTRONIC ASSEMBLY; LEAD-FREE; SOLDER;
D O I
10.1007/BF02651361
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, are potential replacements for Sn-37Pb solder in low-cost electronic assembly. This paper reviews the literature on the microstructure and mechanical properties of these alloys. Because of the processing and testing conditions, many of the data are not predictive for electronic assembly applications. However, eutectic Sn-Bi seems to have properties approaching those of eutectic Sn-Pb under most conditions, while eutectic Sn-In seems far inferior in most respects. Eutectic Sn-Ag has many promising characteristics, but its relatively high melting temperature may preclude its use for this type of application.
引用
收藏
页码:693 / 700
页数:8
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