FABRICATION OF PIEZOELECTRIC THICK-FILM LOW-VOLTAGE MULTILAYER ACTUATORS USING A NEW DOUBLE-PASTE PRINTING TECHNIQUE

被引:26
作者
MOILANEN, H
LEPPAVUORI, S
UUSIMAKI, A
机构
[1] Microelectronics and Material Physics Laboratories, University of Oulu
关键词
D O I
10.1016/0924-4247(93)80020-H
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thick-film technology is of increasing importance in the manufacture of solid-state sensors and actuators. However, fabrication of complicated component structures like actuators based on screen-printed thick-film multilayers (TFMLs) includes significant technical problems still to be solved. A novel double-paste screen-printing technology has been developed for the thick-film fabrication process of piezoelectric TFML actuators. It results in a remarkable improvement in the realization of components incorporating dozens of active piezolayers. New methods have been devised for various thick-film process main stages, including layout considerations, paste printing, active piezoceramic and electrode layer printing. Using previously developed thick-film piezoelectric pastes and commercial electrode paste, low driving voltage (< 40 V) multilayer piezoactuators have been realized. The actuator performance and piezoelectric constants are determined using an interferometric out-of-contact displacement measurement system developed for this purpose.
引用
收藏
页码:106 / 111
页数:6
相关论文
共 6 条
[1]   DETERMINATION OF LOW-VOLTAGE ACTUATOR DISPLACEMENTS IN DC AND AC ELECTRIC-FIELDS USING AN OPTICAL INTERFEROMETER [J].
MOILANEN, H ;
LEPPAVUORI, S .
SENSORS AND ACTUATORS A-PHYSICAL, 1993, 37-8 :555-560
[2]  
MOILANEN H, 1992, ACTUATORS 92, P196
[3]  
NOBLE M, 1989, LASERS OPTRONICS MAR
[4]  
TANUMA C, 1984, 4TH P SENS S JAP, P41
[5]   DEFORMABLE MIRROR USING THE PMN ELECTROSTRICTOR [J].
UCHINO, K ;
TSUCHIYA, Y ;
NOMURA, S ;
SATO, T ;
ISHIKAWA, H ;
IKEDA, O .
APPLIED OPTICS, 1981, 20 (17) :3077-3080
[6]   RECENT TOPICS OF CERAMIC ACTUATORS - HOW TO DEVELOP NEW CERAMIC DEVICES [J].
UCHINO, K .
FERROELECTRICS, 1989, 91 :281-292