GRAIN-BOUNDARY CAVITATION AND SLIDING IN COPPER/TUNGSTEN COMPOSITES DUE TO THERMAL-STRESSES

被引：24

作者：

CHAWLA, KK ^{[1
]}

机构：

[1] INST MIL ENGENHARIA,PCA GEN TIBURCIO URCA,RIO JANEIRO,BRAZIL

来源：

PHILOSOPHICAL MAGAZINE | 1973年 / 28卷 / 02期

关键词：

D O I：

10.1080/14786437308217462

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：401 / 413

页数：13

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