FABRICATION OF AN INSULATED METAL-SUBSTRATE (IMS), HAVING AN INSULATING LAYER WITH A HIGH DIELECTRIC-CONSTANT

被引：13

作者：

ASAI, S

FUNAKI, M

SAWA, H

KATO, K

机构：

[1] Research Center, Denki Kagaku Kougyo K. K., Tokyo 194-01, Asahi-cyo, Machida-city

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1993年 / 16卷 / 05期

关键词：

Dielectric properties - Electronics packaging - Fabrication - Microwave devices - Microwave oscillators - Printed circuit boards;

D O I：

10.1109/33.239878

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A copper-based insulated metal substrate (IMS) having an insulating layer with a high dielectric constant has been developed using an epoxy compound filled with barium titanate filler. In this development, a wide variety of polymers and inorganic fillers as well as coupling agents were tested for their ability to fabricate an insulating layer having a dielectric constant of 26 and a dielectric loss of 0.04 at 400 MHz. The temperature dependence of the cured dielectric was also studied. This copper-based IMS easily allowed for the addition of solder through holes. Reduction in the size of the microstrip line in an UHF power amplifier was attempted. An area less than 1/3 the original size of the conventional glass epoxy printed circuit will be expected with this IMS.

引用

页码：499 / 504

页数：6