MEASUREMENT OF FRACTURE SPEEDS IN SILICON AND GERMANIUM

被引：11

作者：

GREENWOOD, JH

机构：

来源：

INTERNATIONAL JOURNAL OF FRACTURE MECHANICS | 1972年 / 8卷 / 02期

关键词：

D O I：

10.1007/BF00703880

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

引用

页码：183 / 193

页数：11

共 22 条

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