CREEP-FATIGUE INTERACTION IN EUTECTIC LEAD TIN SOLDER ALLOY

被引：22

作者：

WEINBEL, RC ^{[1
]}

TIEN, JK ^{[1
]}

POLLAK, RA ^{[1
]}

KANG, SK ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF MATERIALS SCIENCE | 1987年 / 22卷 / 11期

关键词：

D O I：

10.1007/BF01133338

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：3901 / 3906

页数：6

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