ELECTROTHERMAL SIMULATION OF INTEGRATED-CIRCUITS

被引：73

作者：

LEE, SS ^{[1
]}

ALLSTOT, DJ ^{[1
]}

机构：

[1] CARNEGIE MELLON UNIV,DEPT ELECT & COMP ENGN,PITTSBURGH,PA 15213

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1993年 / 28卷 / 12期

关键词：

D O I：

10.1109/4.262001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes new techniques for simulating the dc and steady-state thermal characteristics of integrated circuits using the incomplete Choleski conjugate gradient (ICCG) method, and transient electrothermal performance using an efficient macromodeling method based on asymptotic waveform evaluation (AWE). Results on several benchmark circuits show orders of magnitude reductions in cpu time and memory with accuracy comparable to that of the traditional techniques.

引用

页码：1283 / 1293

页数：11

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