TIME-TEMPERATURE CURE BEHAVIOR OF EPOXY BASED STRUCTURAL ADHESIVES

被引：19

作者：

DOYLE, MJ

LEWIS, AF

LI, HM

机构：

[1] Department of Materials Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania

[2] 3M Company, St. Paul, Minnesota, 55133

来源：

POLYMER ENGINEERING AND SCIENCE | 1979年 / 19卷 / 10期

关键词：

D O I：

10.1002/pen.760191007

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Time/temperature cure profile diagrams of a nylon‐epoxy adhesive and a rubber‐modified epoxy based structural adhesive have been established from isothermal‐cure time torsional braid analysis measurements. The characteristic zones of liquid, gel‐rubber and glassy state behavior are noted on the diagrams. With the nylon‐epoxy adhesive, the time/temperature cure profile is ill‐defined since all the TBA data had to be obtained (due to the particular curing agent involved) at isothermal conditions above the glass temperature of the finally cured adhesive. In comparison, the rubber‐modified epoxy system showed distinct zones reflecting the various rheological states traversed during the thermosetting process. The dynamic mechanical. (Rheovibron), morphology, and adhesive joint strength properties are examined as a function of cure cycle. Copyright © 1979 Society of Plastics Engineers, Inc.

引用

页码：687 / 691

页数：5