EFFECT OF COLD-DRAWING ON THE YIELD AND FLOW BEHAVIOR OF OFHC COPPER UNDER COMBINED STRESS

被引:2
作者
HOLLOWAY, G [1 ]
SHELTON, A [1 ]
机构
[1] UNIV LONDON IMPERIAL COLL SCI & TECHNOL,LONDON SW7 2AZ,ENGLAND
来源
JOURNAL OF MECHANICAL ENGINEERING SCIENCE | 1979年 / 21卷 / 04期
关键词
D O I
10.1243/JMES_JOUR_1979_021_041_02
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Tests under combinations of tension, torsion and internal pressure have been performed at constant stress ratio on oxygen-free high-conductivity (OFHC) copper, previously annealed and then subjected to progressive reductions in the plug-drawing process. The influence of cold-drawing was investigated by means of six reductions in area up to 81 percent and this showed marked changes in the creep behavior. Logarithmic creep no longer occurred and, in contrast to the annealed material, creep was observed at stresses well below yield when the latter is defined by the backward extrapolation method. The creep rate accelerated rapidly as the yield stress was approached and the creep strain became large compared with the instantaneous strain. Under axial tension-internal pressure, symmetrical yield loci tending progressively towards the Tresca criterion were found for reductions up to 42. 4 percent.
引用
收藏
页码:235 / 245
页数:11
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