TRANSVERSE ISOTROPIC ELASTIC-MODULI AND INPLANE THERMAL-DIFFUSIVITY IN SILICON-SUPPORTED THIN-FILMS OF A PHOTOSENSITIVE POLYIMIDE MEASURED USING IMPULSIVE STIMULATED THERMAL SCATTERING

被引：13

作者：

COCSON, JK ^{[1
]}

HAU, CS ^{[1
]}

LEE, PM ^{[1
]}

POON, CC ^{[1
]}

ZHONG, AH ^{[1
]}

ROGERS, JA ^{[1
]}

NELSON, KA ^{[1
]}

机构：

[1] MIT,DEPT CHEM,CAMBRIDGE,MA 02139

来源：

POLYMER | 1995年 / 36卷 / 21期

基金：

美国国家科学基金会;

关键词：

ISTS CHARACTERIZATION; PHOTOSENSITIVE THIN FILM; ELASTIC/THERMAL PROPERTIES;

D O I：

10.1016/0032-3861(95)90986-C

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Through impulsive stimulated thermal scattering, the elastic and thermal properties of silicon-supported thin films (2-11 mu m thicknesses) of a new low-CTE (coefficient of thermal expansion) photosensitive polyimide based on a biphenyl dianhydride/p-phenylenediamine backbone were studied. The material was found to be mechanically anisotropic. The in-plane thermal diffusivity and the in-plane and through-plane shear and longitudinal sound speeds were determined.

引用

页码：4069 / 4075

页数：7

共 18 条

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