A LOW-COST MULTICHIP PACKAGING TECHNOLOGY FOR MONOLITHIC MICROWAVE INTEGRATED-CIRCUITS

被引：14

作者：

JAYARAJ, K ^{[1
]}

NOLL, TE ^{[1
]}

SINGH, DR ^{[1
]}

机构：

[1] HONEYWELL TECHNOL CTR,MINNEAPOLIS,MN 55418

来源：

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 1995年 / 43卷 / 09期

关键词：

D O I：

10.1109/8.410216

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes a multichip module technology based on highly impermeable liquid crystal polymers (LCP's) to interconnect and package monolithic microwave integrated circuits (MMIC's). Because of the low moisture permeability of the LCP's, the packages can be made hermetic without heavy expensive housings and can be two to four times lighter and one-fifth the cost of conventional ceramic based transmit/receive (T/R) modules. The LCP material has a low dielectric constant (2.65) and low-loss tangent and is manufacturable using high volume, large-area processing methods that provide very reliable highperformance circuits at low cost. Using flip-chip bonded MMIC's attached to a high thermal conductivity, low coefficient of thermal expansion substrate, this innovative technology can meet a variety of commercial, military, and NASA requirements.

引用

页码：992 / 997

页数：6