ENVIRONMENTAL TESTS FOR CONNECTORS AND CONTACT MATERIALS - EVALUATION OF A METHOD INVOLVING SULFUR-DIOXIDE

被引:10
作者
ANTLER, M
DUNBAR, JJ
机构
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1978年 / 1卷 / 01期
关键词
D O I
10.1109/TCHMT.1978.1135252
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:17 / 29
页数:13
相关论文
共 43 条
  • [1] EFFECTS OF INDUSTRIAL AIR-POLLUTANTS ON ELECTRICAL CONTACT MATERIALS
    ABBOTT, WH
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (01): : 24 - 27
  • [2] BASE METAL CONTACTS - EXPLORATORY STUDY OF SEPARABLE CONNECTION TO TIN-LEAD
    ANTLER, M
    GRADDICK, WF
    TOMPKINS, HG
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, PH11 (01): : 35 - 44
  • [3] EFFECT OF ENVIRONMENT ON ELECTRICAL CONTACTS - DISCUSSION AT 1973 HOLM SEMINAR
    ANTLER, M
    ABBOTT, WH
    CAMPBELL, WE
    GARTE, SM
    MAMRICK, MS
    SNOWDEN, AC
    TRZECIAK, MJ
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, PH11 (01): : 57 - 67
  • [4] CORROSION-RESISTANCE OF WORN TIN-NICKEL AND GOLD-COATED TIN-NICKEL ALLOY ELECTRODEPOSITS
    ANTLER, M
    DROZDOWICZ, MH
    HORNIG, CF
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (07) : 1069 - 1075
  • [5] Antler M., 1976, Plating and Surface Finishing, V63, P30
  • [6] ANTLER M, UNPUBLISHED
  • [7] ANTLER M, 1974, GOLD PLATING TECHNOL, P334
  • [8] EVALUATION OF GOLD ELECTRODEPOSITS FOR USE IN DRY CIRCUIT APPLICATIONS
    BAKER, RG
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (01): : 36 - 39
  • [9] BAKER RG, 1976, 8TH P INT C EL CONT, P327
  • [10] BLAKE BE, 1964, 2ND P INT C EL CONT, P531