METAL-CERAMIC CONSTRAINTS FOR MULTILARYER ELECTRONIC PACKAGES

被引：13

作者：

CHANCE, DA

WILCOX, DL

机构：

来源：

PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS | 1971年 / 59卷 / 10期

关键词：

D O I：

10.1109/PROC.1971.8454

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1455 / &

共 21 条

[1]

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[2]

CHANCE D, 1970, AUG AIME TECH C MAT

[3] REFRACTORY METALLIZATION OF GREEN CERAMIC [J].

CHANCE, DA .

METALLURGICAL TRANSACTIONS, 1970, 1 (03) :685-&

[4] CAPILLARY-INFILTRATED CONDUCTORS IN CERAMICS [J].

CHANCE, DA ;

WILCOX, DL .

METALLURGICAL TRANSACTIONS, 1971, 2 (03) :733-&

[5]

COHN SB, 1954, IRE T MICROWAVE THEO, VMTT2, P52

[6]

JANSSON SE, TO BE PUBLISHED

[7]

KUBASCHEWSKI O, 1969, PROGRESS MATER SCI, V14

[8]

MARCUVITZ N, 1951, WAVEGUIDE HDB, P263

[9]

PATTON TC, 1964, PAINT FLOW PAINT DIS, P185

[10]

RICHARDSON FD, 1948, J IRON STEEL I, V160, P261