SEMICONDUCTOR YIELD IMPROVEMENT - RESULTS AND BEST PRACTICES

被引：63

作者：

CUNNINGHAM, SP ^{[1
]}

SPANOS, CJ ^{[1
]}

VOROS, K ^{[1
]}

机构：

[1] UNIV CALIF BERKELEY,MICROFABRICAT LAB,BERKELEY,CA 94720

来源：

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 1995年 / 8卷 / 02期

关键词：

Assembly - Computer aided manufacturing - Economics - Failure analysis - Industrial management - Quality control - Research and development management - Semiconductor device testing - Statistical process control;

D O I：

10.1109/66.382273

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The results of a world-wide study on yield improvement are presented. Die yields collected from 21 fabs are transformed via a legit formula and compared. The die yields and die yield improvement rates of the fabs are compared, and manufacturing yield improvement practices are evaluated. Preliminary results of this continuing study indicate that die yield improvement is a function of computer-aided manufacturing practices and statistical process control practices in addition to commonly cited practices such as particle control and advanced manufacturing technology.

引用

页码：103 / 109

页数：7