POLYIMIDE-SUBSTRATE BONDING STUDIES USING GAMMA-APS COUPLING AGENT

被引：13

作者：

ANDERSON, HR

KHOJASTEH, MM

MCANDREW, TP

SACHDEV, KG

机构：

[1] IBM, Hopewell Junction, NY, USA, IBM, Hopewell Junction, NY, USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1986年 / 9卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1986.1136662

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：364 / 369

页数：6

共 32 条

[1]

ANDERSON HR, 1984, SEP INT ADH C

[2]

Bikerman J. J., 1968, SCI ADHESIVE JOINTS

[3]

BUCHWALTER LP, 1984, POLYIMIDES, V1

[4] USE OF X-RAY PHOTOELECTRON-SPECTROSCOPY TO STUDY THE FAILURE OF AN ADHESIVE JOINT BETWEEN 2 POLYMERS [J].

CHAN, CM .

JOURNAL OF ADHESION, 1983, 15 (3-4) :217-224

[5] APPLICATION OF ESCA TO POLYMER CHEMISTRY .16. ELECTRON MEAN FREE PATHS AS A FUNCTION OF KINETIC-ENERGY IN POLYMERIC FILMS DETERMINED BY MEANS OF ESCA [J].

CLARK, DT ;

THOMAS, HR .

JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY, 1977, 15 (12) :2843-2867

[6]

CROLL SG, 1983, ADHESION ASPECTS POL

[7] CHARACTERIZATION OF S-GLASS-POLYSULFONE ADHESIVE FAILURE USING ION-SCATTERING SPECTROSCOPY AND SECONDARY ION MASS-SPECTROMETRY [J].

DIBENEDETTO, AT ;

SCOLA, DA .

JOURNAL OF COLLOID AND INTERFACE SCIENCE, 1980, 74 (01) :150-162

[8] VARIATION OF BOND STRENGTH WITH TEMPERATURE - A PRELIMINARY STUDY OF METAL-TO-METAL ADHESION [J].

FOULKES, H ;

SHIELDS, J ;

WAKE, WC .

JOURNAL OF ADHESION, 1970, 2 (OCT) :254-&

[9]

Greenblatt J., 1984, POLYIMIDES SYNTHESIS

[10]

GUPTA MR, 1985, 2ND P INT C POLY, P738

← 1 2 3 4 →