MICROSTRUCTURAL EVOLUTION IN SN/PB SOLDER AND PD/AG THICK-FILM CONDUCTOR METALLIZATION

被引：19

作者：

LIU, KC

DUH, JG

机构：

[1] Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 04期

关键词：

D O I：

10.1109/33.105120

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Intermetallic compound formation between thick film mixed bonded conductor and Sn/Pb solder is investigated. Microstructural evolution of the interfacial morphology, elemental, and phase distribution are probed with the aid of electron microscopy and X-ray diffraction. A decrease in adhesion strength occurs when the sample is aged at 130-degrees-C for long periods of time. Microstructural analysis reveals the formation of intermetallic compounds Pd3Sn, Pd2Sn, Pd3Sn, PdSn, Pd3Pb, Ag5Sn, and Ag3Sn. A possible mechanism of adhesion loss for the conductor is described. In the initial stage, the fracture interface is located where the Pd3Pb exists, which is near the solder. However, the fracture takes place within the solder after aging. It is argued that volume change of the conductor film resulting from the intermetallic formation and incoherency between the compounds due to grain growth are major factors in the degradation of the peel strength.

引用

页码：703 / 707

页数：5

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