LOW-TEMPERATURE ROUTES TO JOINING CERAMICS FOR HIGH-TEMPERATURE APPLICATIONS

被引：32

作者：

DALGLEISH, BJ ^{[1
]}

TOMSIA, AP ^{[1
]}

NAKASHIMA, K ^{[1
]}

LOCATELLI, MR ^{[1
]}

GLAESER, AM ^{[1
]}

机构：

[1] LAWRENCE BERKELEY LAB,CTR ADV MAT,BERKELEY,CA 94720

来源：

SCRIPTA METALLURGICA ET MATERIALIA | 1994年 / 31卷 / 08期

关键词：

D O I：

10.1016/0956-716X(94)90524-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：1043 / 1048

页数：6

共 22 条

[1] SOLID-STATE METAL CERAMIC BONDING OF PLATINUM TO ALUMINA [J].

ALLEN, RV ;

BORBIDGE, WE .

JOURNAL OF MATERIALS SCIENCE, 1983, 18 (09) :2835-2843

[2]

ALLEN RV, 1981, PLATIN MET REV, V25, P152

[3]

DALGLEISH BJ, 1993, UNPUBB

[4]

DALGLEISH BJ, 1989, UNPUB

[5] METAL CERAMIC JOINING [J].

ELSSNER, G ;

PETZOW, G .

ISIJ INTERNATIONAL, 1990, 30 (12) :1011-1032

[6]

GLAESER AM, 1993, CERAMIC T, V34, P341

[7] PARTIAL TRANSIENT LIQUID-PHASE METALS LAYER TECHNIQUE OF CERAMIC METAL-BONDING [J].

IINO, Y .

JOURNAL OF MATERIALS SCIENCE LETTERS, 1991, 10 (02) :104-106

[8] COPPER ON SAPPHIRE - STABILITY OF THIN-FILMS AT 0.7-TM [J].

KENNEFICK, CM ;

RAJ, R .

ACTA METALLURGICA, 1989, 37 (11) :2947-2952

[9]

KOIZUMI M, 1987, HIGH TECH CERAMICS, P1033

[10] INFLUENCE OF INTERFACE IMPURITIES ON THE FRACTURE ENERGY OF UHV BONDED NIOBIUM SAPPHIRE BICRYSTALS [J].

KORN, D ;

ELSSNER, G ;

FISCHMEISTER, HF ;

RUHLE, M .

ACTA METALLURGICA ET MATERIALIA, 1992, 40 :S355-S360

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