THE POWER OF CONNECTIONS

被引:6
作者
KEYES, RW
机构
来源
IEEE CIRCUITS AND DEVICES MAGAZINE | 1991年 / 7卷 / 03期
关键词
D O I
10.1109/101.79794
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
[No abstract available]
引用
收藏
页码:32 / 35
页数:4
相关论文
共 4 条
[1]   THE THIN-FILM MODULE AS A HIGH-PERFORMANCE SEMICONDUCTOR PACKAGE [J].
HO, CW ;
CHANCE, DA ;
BAJOREK, CH ;
ACOSTA, RE .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (03) :286-296
[2]   LARGE-SCALE INTEGRATION - WHAT IS YET TO COME [J].
NOYCE, RN .
SCIENCE, 1977, 195 (4283) :1102-1106
[3]   DIGITAL OPTICAL COMPUTING [J].
SAWCHUK, AA ;
STRAND, TC .
PROCEEDINGS OF THE IEEE, 1984, 72 (07) :758-779
[4]  
UCHIDA N, COMPCON SPRING 90 DI, P4