3-DIMENSIONAL FINITE-ELEMENT ANALYSIS OF THIN-FILM STRESSES USING ALGOR PERSONAL-COMPUTER-BASED SOFTWARE

被引：5

作者：

KRUS, D

MEARINI, G

CHAFFEE, K

HOFFMAN, RW

机构：

[1] Department of Physics, Case Western Reserve University, Cleveland

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1991年 / 9卷 / 04期

关键词：

D O I：

10.1116/1.577261

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

ALGOR, a commercially available, personal-computer-based, finite element software package was used to study three-dimensional stress-strain relations in both free standing and adherent thin films. The accuracy of the analyses was verified by comparison to tensile tests and analytical calculations of radius of curvature. The results also agree with earlier two-dimensional calculations. The program was used to simulate tensile testing in order to establish limits on film dimensions to yield Young's modulus upon the application of a uniaxial stress approximation. Stress contours and deflections arising from submicroscopic elastic Poisson effects (necking) were determined for different film dimensions. In addition, the effect of using adhesives in sample mounting for tensile testing was studied, and the three dimensional models and results are compared to similar two-dimensional calculations.

引用

页码：2488 / 2493

页数：6

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