INTERMETALLIC PHASE-FORMATION IN THIN SOLID-LIQUID DIFFUSION COUPLES

被引：90

作者：

BARTELS, F ^{[1
]}

MORRIS, JW ^{[1
]}

DALKE, G ^{[1
]}

GUST, W ^{[1
]}

机构：

[1] MAX PLANCK INST MET RES,D-70156 STUTTGART,GERMANY

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 08期

关键词：

DIFFUSION; INTERMETALLIC COMPOUND; SOLDER;

D O I：

10.1007/BF02651374

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Conducting joints with low fabrication temperatures and high thermal stability are useful in modern electronics. This paper discusses the potential use of intermetallic phases in making such joints. Thin interconnection layers that consist entirely of intermetallic phases have been produced by joining planar Cu substrates that are coated with thin films of Sn. Thin layers (1-5 mum) of intermetallic phase are produced at temperatures slightly above the melting temperature of Sn in a process similar to reflow soldering. Metallography and x-ray analysis are used to characterize the formation mechanism of the intermetallic. Cu dissolves into the liquid Sn by diffusion along narrow channels between grains of the growing eta-Cu6Sn5 intermetallic phase. Tensile tests were used to measure mechanical properties. The joint strength increased with reaction time. The joint fails in a ductile mode as long as unreacted Sn is present, but fractures along interphase boundaries when the joint is completely intermetallic.

引用

页码：787 / 790

页数：4