THE MELTING TEMPERATURE OF THIN LEAD FILMS

被引:13
作者
TSUBOI, T [1 ]
SEGUCHI, Y [1 ]
SUZUKI, T [1 ]
机构
[1] KYOTO UNIV,FAC SCI,DEPT PHYS,SAKYO KU,KYOTO 606,JAPAN
关键词
calorimetry; constrained film; lead; melting temperature; solid-liquid transition; thin film;
D O I
10.1143/JPSJ.59.1314
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Experimental observation has been made on melting temperature (Tm) of thin Pb films by means of differential scanning calorimetry, whose thickness ranges from 100 to 2000 Å. The films are constrained by different kinds of materials (Ge, MgF2, Al, Cu, Cr and Mn) which have higher melting temperatures than Pb. The melting temperature is lowered with decreasing thickness for all wall materials. The depression of Tm from the bulk value reaches about 10°C for films of 100 Å thickness. The thickness dependence of Tm is explained in terms of interfacial energies, and shows that melting begins at the grain boundary. Supercooling behavior has been investigated, and it is confirmed that the solid-liquid transition of the films is the first order. © 1990, THE PHYSICAL SOCIETY OF JAPAN. All rights reserved.
引用
收藏
页码:1314 / 1321
页数:8
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