INORGANIC-COMPOUNDS IN ELECTROLESS COPPER DEPOSITION

被引：9

作者：

BIELINSKI, J

KAMINSKI, K

机构：

来源：

关键词：

D O I：

10.1016/0257-8972(87)90075-2

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：223 / 233

页数：11

共 54 条

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[2]

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[3]

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[5]

Bielinski J., 1986, OBERFLACHE SUR, V27, P8

[6]

BIELINSKY J, 1984, METALLOBERFLACHE, V38, P20

[7]

BRANDT W, 1973, Patent No. 2160821

[8] ELECTROLESS COPPER PLATING OF RESIN-COATED OPTICAL FIBERS [J].

CHATTERJEE, B .

SURFACE TECHNOLOGY, 1984, 23 (04) :333-340

DONAHUE, FM ;

WONG, KLM ;

BHALLA, R .

[10]

FELDSTEIN N, 1973, Patent No. 3720525