THE DEPOSITION AND ADHESION OF COPPER-FILMS ON SMOOTH POLYMER SURFACES

被引：8

作者：

EISCH, JJ

LASKOWSKI, J

BIELINSKI, J

BOLESLAWSKI, MP

机构：

[1] Department of Chemistry, The State University of New York at Binghamton, Binghamton, New York, 13902-6000, NY

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 1995年 / 14卷 / 02期

关键词：

D O I：

10.1007/BF00456572

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：146 / 147

页数：2

共 13 条

[1]

BAUMGARTNER CE, 1992, PLAT SURF FINISH, V79, P53

[2]

CHOU NJ, 1990, NEW CHARACTERIZATION, P289

[3] COMPLEXES OF 2- AND 4-VINYLPYRIDINE WITH BIVALENT MANGANESE, IRON, COPPER AND ZINC [J].

COLLIN, RJ ;

LARKWORTHY, LF .

JOURNAL OF INORGANIC & NUCLEAR CHEMISTRY, 1975, 37 (01) :334-338

[4] A NUCLEAR-SCATTERING EVALUATION OF ORGANOMETALLIC BONDING IN THE ADHESION OF METALLIZATION TO POLYMERS [J].

CURRIE, J ;

DEPELSENAIRE, P ;

GROLEAU, R ;

SACHER, E .

JOURNAL OF COLLOID AND INTERFACE SCIENCE, 1984, 97 (02) :410-422

[5]

EISCH JJ, 1992, Patent No. 5100693

[6]

EISCH JJ, 1991, Patent No. 5063083

[7]

EISCH JJ, UNPUB

[8]

PARK JM, 1983, THESIS U CONNECTICUT

[9] PHOTOCHEMICAL SELECTIVE ACTIVATION FOR ELECTROLESS METAL-DEPOSITION ON NON-CONDUCTORS [J].

PAUNOVIC, M .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (09) :C441-C447

[10]

Polichette J., 1973, US Patent, Patent No. [3,772,078, 3772078]

← 1 2 →