SINGLE-LAYER RESIST FOR DEEP, MICROMETER AND NANOMETER STRUCTURE TRANSFER

被引:6
作者
HUDEK, P
BORKOWICZ, Z
KOSTIC, I
RANGELOW, IW
KASSING, R
机构
[1] Inst. of Technical Physics, University of Kassel, 3500 Kassel
[2] Inst. of Computer Systems, Slovak Academy of Sciences, 842 37 Bratislava
[3] Inst. of Electron Technology, Technical Univ. of Wroclaw, 67 640 Wroclaw
关键词
D O I
10.1016/0167-9317(93)90074-F
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The performance of the AZ PF 514 positive resist in single-layer electron-beam lithography (EBL) and reactive ion etching (RIE) has been investigated. The fabrication possibilities of silicon micromechanical parts and structures with nanometer details are presented. The basic lithographic and pattern transfer properties are discussed.
引用
收藏
页码:283 / 288
页数:6
相关论文
共 9 条
[1]  
Pilz, Et al., SPIE Vol. 1392, Advanced techiniques for IC processing, 77, (1990)
[2]  
Rangelow, Nano-resolution tri-level process by down-stream-microwave RF-biased etching, Proc. Microcircuit Engineering '91, (1991)
[3]  
Borkowicz, Et al., Plasma treated spin-on-glass for submicron tri-level lithography, Proc. Microcircuit Engineering '91, (1991)
[4]  
Winters, Coburn, Surface science aspects of etching reactions, Surface Science Reports, 14, (1992)
[5]  
Rangelow, Et al., Microelectronic Eng., 4, (1986)
[6]  
Rangelow, Fichelscher, Chlorine or bromine chemistry in RIE Si-trench etching, SPIE, 1392, (1990)
[7]  
Ballhorn, Et al., Performance optimization of the chemically amplified radiation resist RAY-PF, Proc. Microcircuit Eng. '90, (1990)
[8]  
Pongratz, Et al., E-beam application of highly sensitive positive and negative-tone resists for x-ray mask making, Proc. SPIE 1089, E-beam, X-ray, and Ion beam technology, 8, (1989)
[9]  
Hatzakis, Stewart, Shaw, Rishton, New high resolution and high sensitivity deep uv, x-ray, and electron beam resists, Proc. Microcircuit Eng. '89, (1989)