A BALANCED RESONANT PRESSURE SENSOR

被引:15
作者
STEMME, E [1 ]
STEMME, G [1 ]
机构
[1] CHALMERS UNIV TECHNOL, DEPT SOLID STATE ELECTR, S-41296 GOTHENBURG, SWEDEN
关键词
D O I
10.1016/0924-4247(90)85067-E
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new type of resonant pressure sensor in silicon is described. The pressure sensitive part consists of a square dual-diaphragm cavity structure which vibrates in a balanced torsional mode. The selected torsional mode in combination with a suspension along the two crossing node lines of the electrostatically vibrated part yields a high Q factor of 2400 in air and 80 000 in a vacuum. The pressure sensitivity is a result of a pressure change-induced flexure of the two diaphragms which changes the torsional stiffness and hence the resonance frequency. The pressure sensitivity of the differential and absolute pressure sensor was 19%/bar and 14%/bar respectively. The basic structure showed an inherent uncompensated low temperature sensitivity of - 16 ppm/°C. The fabrication process involving anisotropic silicon etching and silicon thermal bonding is described. The improved design which increased the Q factor in air to 3300 is also presented. © 1990.
引用
收藏
页码:336 / 341
页数:6
相关论文
共 11 条
[1]   RESONANT SILICON STRUCTURES [J].
BUSER, RA ;
DEROOIJ, NF .
SENSORS AND ACTUATORS, 1989, 17 (1-2) :145-154
[2]   ETCHED SILICON VIBRATING SENSOR [J].
GREENWOOD, JC .
JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1984, 17 (08) :650-652
[3]  
HOWE RT, 1987, 4TH INT C SOL STAT S, P843
[4]  
LAMMERINK TSJ, 1985, 3RD P INT C SOL STAT, P97
[5]   WAFER BONDING FOR SILICON-ON-INSULATOR TECHNOLOGIES [J].
LASKY, JB .
APPLIED PHYSICS LETTERS, 1986, 48 (01) :78-80
[6]   CONTROLLED ETCHING OF SILICON IN CATALYZED ETHYLENEDIAMINE-PYROCATECHOL-WATER SOLUTIONS [J].
REISMAN, A ;
BERKENBLIT, M ;
CHAN, SA ;
KAUFMAN, FB ;
GREEN, DC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (08) :1406-1415
[7]  
SMITS JG, 1985, 3RD P INT C SOL STAT, P93
[8]  
STEMME E, 1990, IN PRESS IEEE T ELEC
[9]  
STEMME E, Patent No. 88030929
[10]  
STEMME E, Patent No. 89012090