THERMAL-CONDUCTIVITY OF EPOXY ADHESIVES FILLED WITH SILVER PARTICLES

被引：62

作者：

BJORNEKLETT, A ^{[1
]}

HALBO, L ^{[1
]}

KRISTIANSEN, H ^{[1
]}

机构：

[1] ABB CORP RES,N-1361 BILLINGSTADSLETTA,NORWAY

来源：

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 1992年 / 12卷 / 02期

关键词：

METAL POLYMER COMPOSITE; SILVER-FILLED EPOXY ADHESIVE; THERMAL CONDUCTIVITY; HOT WIRE TECHNIQUE;

D O I：

10.1016/0143-7496(92)90030-Y

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The thermal conductivity of a silver-filled epoxy adhesive has been measured with the transient hot wire technique at various temperatures and silver concentrations. Experimental results are compared with theoretical results for thermal conduction in two-phase materials. The results show that the thermal conductivity of silver-filled adhesives is higher than the theoretically expected values due to the formation of elongated agglomerates of silver particles.

引用

页码：99 / 104

页数：6

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