ORIGINS OF STRESS IN THIN NICKEL FILMS

被引：184

作者：

DOLJACK, FA

HOFFMAN, RW

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(72)90396-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：71 / &

共 5 条

[1] DOLJACK FA, TO BE PUBLISHED
[2] FINEGAN JD, 1961, AEC18 TECH REP
[3] DIFFUSIVITY AND SOLUBILITY OF SI IN AL METALLIZATION OF INTEGRATED CIRCUITS
MCCALDIN, JO
SANKUR, H
[J]. APPLIED PHYSICS LETTERS, 1971, 19 (12) : 524 - &
[4] LOW TEMPERATURE DIFFUSION IN POLYCRYSTALLINE THIN-FILM GOLD-NICKEL COUPLES
RICHARDS, JL
MCCANN, WH
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04): : 644 - &
[5] INTERDIFFUSION IN CU-NI, CO-NI, AND CO-CU
TRONSDAL, GO
SORUM, H
[J]. PHYSICA STATUS SOLIDI, 1964, 4 (03): : 493 - 498