THE EFFECT OF ELECTRONIC EXCITATION PRODUCED BY AN ELECTRON SHOWER ON THE ADHESION OF COPPER-FILMS DEPOSITED ON STAINLESS-STEEL

被引：7

作者：

YUMOTO, H ^{[1
]}

WATANABE, K ^{[1
]}

AKASHI, K ^{[1
]}

IGATA, N ^{[1
]}

机构：

[1] SCI UNIV TOKYO,DEPT IND & ENGN CHEM,NODA,CHIBA 278,JAPAN

来源：

APPLIED SURFACE SCIENCE | 1991年 / 48-9卷

关键词：

D O I：

10.1016/0169-4332(91)90326-F

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The adhesion of a copper film made by the electron shower method was at least 100 times higher than that of films made by conventional thermal vapor deposition. We attribute the difference to a change in the adhesion mechanism from physical adsorption to chemical adsorption. Both the copper vapor and the substrate were electronically excited by the electron shower, and the copper atoms formed chemical complexes such as CuO or Cu2O with oxygen on the surface of the substrate.

引用

页码：173 / 177

页数：5

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