VOLTAMMETRIC BEHAVIOR OF THE COPPER(II) THIOUREA SYSTEM IN SULFURIC-ACID MEDIUM AT PLATINUM AND GLASSY-CARBON ELECTRODES

被引：31

作者：

COFRE, P

BUSTOS, A

机构：

[1] Facultad de Quimica, Pontificia Universidad Católica de Chile, Santiago, 4860, Vicuña Mackenna

来源：

JOURNAL OF APPLIED ELECTROCHEMISTRY | 1994年 / 24卷 / 06期

关键词：

D O I：

10.1007/BF00249859

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Thiourea, a levelling agent used in copper electrorefining baths, is the focus of a cyclic and rotating disc or ring-disc electrode voltammetric study. Thiourea adsorption, its interaction with Cu2+ and formation of Cu(Tu)n+ complexes are part of the multistep electrode mechanism proposed. Results at platinum and glassy carbon electrodes are applicable to copper electrodes in electrorefining.

引用

页码：564 / 568

页数：5

共 12 条

[1]

BISWAS AK, 1976, EXTRACTIVE METALLURG, P303

[2]

BUSTOS A, 1990, AN QUIM, V86, P453

[3] A STUDY OF ADSORPTION OF THIOUREA ON MERCURY BY CHRONOCOULOMETRY [J].