PHOTOELECTROCHEMICAL DEPOSITION OF COPPER ON TIO2 PARTICLES - GENERATION OF COPPER PATTERNS WITHOUT PHOTORESISTS

被引：19

作者：

MORISHITA, S

机构：

来源：

CHEMISTRY LETTERS | 1992年 / 10期

关键词：

D O I：

10.1246/cl.1992.1979

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

In the presence of EDTA or 2,2',2"-nitrilotriethanol, copper was photoelectrochemically deposited on TiO2 particles. Selective deposition of copper on irradiated parts of a TiO2-sol-adhered alumina plate was accomplished in an electroless copper plating solution containing EDTA.

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页码：1979 / 1982

页数：4

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