GROWTH-KINETICS, POLYMERIZATION AND PROTECTION OF CU-X-BTA FILMS

Corrosion and oxidation of copper films were evaluated as a function of surface pretreatment with inhibitors. Electrochemical measurements, accelerated corrosion tests and thermal oxidation were used. Copper surfaces were characterized by ellipsometry, Auger electron spectroscopy, time-of-flight static SIMS, high temperature-Knudsen effusion-mass spectrometry and Kelvin probe. Cu does not react with 1 OH-BTA and 1 CH3-BTA. However, 5 CH3-BTA, 5 CL-BTA and 1 H-BTA form protective surface films with a number of similar characteristics : growth kinetics, thermal stability, degree of polymerization and surface wetting. The extent of corrosion protection provided by these films is comparable in many cases. However, in chloride-containing atmospheres, surfaces treated with 5 CI-BTA are the most resistant to corrosion.