THE INTERTOOL PROFILE INTERCHANGE FORMAT - AN OBJECT-ORIENTED APPROACH

被引：10

作者：

BONING, DS

HEYTENS, ML

WONG, AS

机构：

[1] MOTOROLA INC,CTR ADV TECHNOL,MESA,AZ

[2] MIT,MICROSYST TECHNOL LAB,CAMBRIDGE,MA 02139

来源：

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 1991年 / 10卷 / 09期

关键词：

D O I：

10.1109/43.85761

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A formal object-oriented approach to the data structuring and data management of semiconductor wafer structure and device information is presented. The profile interchange format (PIF) is extended beyond a file format "intersite" version in order to enhance the storage and access of profile information, the communication of profile information between cooperating tools, and the integration and portability of technology CAD tools. An intertool PIF toolkit is a programmatic interface to profile information, consisting of a library of objects for the storage and manipulation of data by technology CAD (TCAD) tools. PIF/Gestalt is presented as a test implementation of the toolkit which provides C and Common Lisp language interfaces, implemented on a data base for use in a CAD/CIM system for semiconductor process design and fabrication. Test applications using PIF/Gestalt demonstrate the desirability of the formal object model, the appropriateness of an object-oriented interface, and implementation of that model on an object-oriented data base.

引用

页码：1150 / 1156

页数：7

共 11 条

[1]

AFSARMANESH H, 1989, NOV P IEEE INT C CAD, P384

[2]

BOBROW DG, 1988, COMMON LISP OBJECT S

[3] DATA STRUCTURING FOR PROCESS AND DEVICE SIMULATIONS [J].