IR MICROSCOPIC OBSERVATION OF PLASTIC COATED TAB INNER LEAD BONDS DEGRADING DURING THERMAL CYCLING

被引：3

作者：

ALPERN, P

TILGNER, R

机构：

[1] Siemens AG

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1992年 / 15卷 / 01期

关键词：

D O I：

10.1109/33.124200

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

IR microscopy investigations of tape automated bonding (TAB) contacted chips are described. The ability of the method to detect mechanical stress fields in silicon as induced by a bump or a load is demonstrated. In the case of plastic coated TAB devices the degradation of the chip after thermal cycling is observed a long time before it may be registered electrically.

引用

页码：114 / 117

页数：4