FABRICATION OF GOLD BUMPS USING GOLD SULFITE PLATING

被引：58

作者：

HONMA, H ^{[1
]}

HAGIWARA, K ^{[1
]}

机构：

[1] KANTO GAKUIN UNIV,GRAD SCH,KANAZAWA KU,YOKOHAMA,KANAGAWA 236,JAPAN

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1995年 / 142卷 / 01期

关键词：

D O I：

10.1149/1.2043948

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Fabrication of small gold bumps (20 similar to 100 mu m in size) on silicon substrates were investigated using gold sulfite plating. To improve the stability of the gold sulfite plating bath, the behavior of the decomposition procedures and evaluation of the stabilizer were also studied. It was confirmed that Au metal and Au3+ ions were produced in the decomposed plating solution. The most effective stabilizer was 2,2'-bipyridine. This greatly improved the stability of the bath. The gold sulfite electrolyte did not attack the photoresist, and straight-walled bumps With 20 mu m in pitch and 20 mu m in height can be obtained.

引用

页码：81 / 87

页数：7

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