LASER-ASSISTED ACTIVATION AND METALLIZATION OF POLYIMIDES

被引:15
作者
SHAFEEV, GA
机构
[1] General Physics Institute, Russian Academy of Sciences, Moscow
来源
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 1992年 / 55卷 / 04期
关键词
D O I
10.1007/BF00324089
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Experimental results are presented on the maskless metallization of the surface of polyimides. In a certain range of laser parameters (Ar+ and copper-vapor lasers) the surface of polyimides irradiated in the air becomes catalytically active with respect to copper deposition from the solution for electroless copper plating. Copper lines 50-100 mum wide are deposited on the Kapton films with good adherence.
引用
收藏
页码:387 / 390
页数:4
相关论文
共 11 条
[1]   LASER-ASSISTED DEPOSITION FOR ELECTRONIC PACKAGING APPLICATIONS [J].
BAUER, A ;
GANZ, J ;
HESSE, K ;
KOHLER, E .
APPLIED SURFACE SCIENCE, 1990, 46 (1-4) :113-120
[2]  
BROOK MR, 1991, APPL PHYS A-MATER, V52, P78
[4]   INVESTIGATION OF THE MECHANISM OF THE UV-INDUCED PALLADIUM DEPOSITION PROCESS FROM THIN SOLID PALLADIUM ACETATE FILMS [J].
ESROM, H ;
KOGELSCHATZ, U .
APPLIED SURFACE SCIENCE, 1990, 46 (1-4) :158-162
[5]  
GERASSIMOV RB, 1982, APPL PHYS B-PHOTO, V28, P266
[6]   LASER WRITING OF COPPER LINES FROM METALORGANIC FILMS [J].
GUPTA, A ;
JAGANNATHAN, R .
APPLIED PHYSICS LETTERS, 1987, 51 (26) :2254-2256
[7]   LASER DIRECT WRITING OF COPPER ON VARIOUS THIN-FILM SUBSTRATE MATERIALS [J].
MULLER, HG ;
BUSCHICK, K ;
SCHULER, S ;
PAREDES, A .
APPLIED SURFACE SCIENCE, 1990, 46 (1-4) :143-147
[8]  
MULLER HG, 1990, APPL PHYS LETT, V56, P904, DOI 10.1063/1.102624
[9]  
SHRINAVASAN R, 1982, J AM CHEM SOC, V104, P6784
[10]  
SHRINIVASAN R, 1987, INTERFACES LASER IRR, P359