NODULE FORMATION IN ELECTROLESS COPPER BATHS

[1] EFFECTS OF STABILIZING ADDITIVES ON MICROSTRUCTURE AND PROPERTIES OF ELECTROLESS COPPER-DEPOSITS [J]. METALLURGICAL TRANSACTIONS, 1974, 5 (05): : 1215 - 1223

[2] EHRICH HJ, 1977, GALVANOTECHNIK, V68, P960

[3] GEMMLER A, 1984, METALLOBERFLAECHE, V38, P11

[4] GMELIN, 1966, HDB ANORG CHEM B, V8, P1456

[5] HIROHATA H, 1972, KONZOKU HYOMEN GIJUT, V23, P465

[6] JUNGINGER R, UNPUB

[7] USE OF ORGANIC ADDITIVES TO STABILIZE AND ENHANCE DEPOSITION RATE OF ELECTROLESS COPPER PLATING [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (11) : 1491 - +

[8] Sillen L.G., 1964, STABILITY CONSTANTS

[9] SILLEN LG, 1971, STABILITY CONSTANT S, V1

[10] 1981, CRC HDB SERIES INORG, V2

[1] EFFECTS OF STABILIZING ADDITIVES ON MICROSTRUCTURE AND PROPERTIES OF ELECTROLESS COPPER-DEPOSITS [J]. METALLURGICAL TRANSACTIONS, 1974, 5 (05): : 1215 - 1223

[2] EHRICH HJ, 1977, GALVANOTECHNIK, V68, P960

[3] GEMMLER A, 1984, METALLOBERFLAECHE, V38, P11

[4] GMELIN, 1966, HDB ANORG CHEM B, V8, P1456

[5] HIROHATA H, 1972, KONZOKU HYOMEN GIJUT, V23, P465

[6] JUNGINGER R, UNPUB

[7] USE OF ORGANIC ADDITIVES TO STABILIZE AND ENHANCE DEPOSITION RATE OF ELECTROLESS COPPER PLATING [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (11) : 1491 - +

[8] Sillen L.G., 1964, STABILITY CONSTANTS

[9] SILLEN LG, 1971, STABILITY CONSTANT S, V1

[10] 1981, CRC HDB SERIES INORG, V2