ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING

被引:35
作者
PAIK, KW
RUOFF, AL
机构
[1] Department of Materials Science and Engineering, Cornell University, Ithaca
基金
美国国家科学基金会;
关键词
Adhesion enhancement; copper films; ion etching; mechanical interlocking; polyimide;
D O I
10.1163/156856190X00432
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Polyimide (PI) films were modified by O2 reactive ion beam etching (RIBE) to enhance the adhesion of subsequently deposited copper films. The adhesion of evaporated copper on the O2 RIBE-modified PI consisted of three different regimes. The first regime involved chemical reaction between PI and Cu atoms; the second regime involved the mechanical interlocking of the grass-like structure of the modified PI with Cu; and in the third regime, overetching was observed. The locus of failure was also analyzed to understand the adhesion mechanism of Cu on the PI. A 10% decrease in adhesion strength was observed after thermal cycling. Furthermore, humidity tests showed that the adhesion enhancement by mechanical interlocking of the grass-like structure is not affected by the presence of moisture. © VSP 1990.
引用
收藏
页码:465 / 474
页数:10
相关论文
共 11 条
  • [1] Mittal K.L., Polyimides: Synthesis, Characterization and Applications, 1-2, (1984)
  • [2] Chou N.J., Dong D.W., Kim J., Liu A.C., J. Electrochem. Soc., 131, (1984)
  • [3] Haight R., Paper presented at the 1987 Materials Research Society Fall Meeting
  • [4] Vanderlinde W.E., (1988)
  • [5] Paik K.W., (1989)
  • [6] Chou N.J., Paraszczak J., Babich E., Heidenreich J., Chaug Y.S., Goldbladtt R.D., J. Vac. Sci. Technol., A5, (1987)
  • [7] Pochan J.M., Gerenser L.J., Elman J.F., Polymer, 27, (1986)
  • [8] Paik K.W., Ruoff A.L., Mater. Res. Soc. Symp. Proc., 119, (1988)
  • [9] Harper J.M.E., Cuomo J.J., Kaufman H.R., J. Vac. Sci. Technol., 21, (1982)
  • [10] Schmuchler G., Encyclopedia of Polymer Science and Technology, 2, (1967)