BSCCO-2212 THICK-FILMS ON A FLEXIBLE YSZ SUBSTRATE

The potential use of flexible YSZ as a substrate material for the partial-melt growth, PMG, of Bi-2212 thick films was studied. Results show low critical temperatures, T(c), ( < 50 K) and degradation in the flexibility of the YSZ due to inter-diffusion. The T(c) was significantly improved ( > 80 K) when Ag was used as a buffer layer. The optimum peak processing temperatures were found to decrease with increasing buffer-layer thickness. The critical current density, J(c), also improved with increasing buffer-layer thickness. The self-field J(c) of these Bi-2212/Ag/YSZ composites was 1-3 x 10(3) A/CM2 at 20 K, significantly lower than that for the Bi-2212/Ag tapes. However, the present study strongly supports the viability of using flexible YSZ with an appropriate buffer in the wind-and-react fabrication of high-T(c) pancake coils. The microstructure and transport properties of Bi-2212/YSZ and Bi-2212/Ag/YSZ composite structures will be discussed.