HIGH HEAT-FLUX COOLING FOR SILICON HYBRID MULTICHIP PACKAGING

被引：11

作者：

JAEGER, RC ^{[1
]}

GOODLING, JS ^{[1
]}

BAGINSKI, ME ^{[1
]}

ELLIS, CD ^{[1
]}

WILLIAMSON, NV ^{[1
]}

OBARR, RM ^{[1
]}

机构：

[1] AUBURN UNIV, ALABAMA MICROELECTR SCI & TECHNOL CTR, DEPT MECH ENGN, AUBURN, AL 36849 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期

关键词：

D O I：

10.1109/33.49046

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：772 / 779

页数：8

共 17 条

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[3]

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[4]

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[5]

HANNEMANN R, 1986, RES NEEDS ELECTRONIC

[6]

Incropera F.P., 1985, FUNDAMENTALS HEAT MA, V2nd ed.

[7]

JAEGER RC, 1989, 5 IEEE SEMITHERM P, P140

[8]

JAEGER RC, 1987, NOV P IEPS BOST, P944

[9] UPPER LIMIT OF CHF IN THE SATURATED FORCED-CONVECTION BOILING ON A HEATED DISK WITH A SMALL IMPINGING JET [J].

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JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1979, 101 (02) :265-269

[10]

LIENHARD JH, 1970, J HEAT TRANSFER FEB, P1

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