THE EFFECT OF COPPER AND SILVER SUBSTRATES ON THE STRUCTURE, INTERNAL-STRESS, AND ELECTRODE POTENTIAL DURING THE INITIAL-STAGES OF GOLD ELECTRODEPOSITION

被引：12

作者：

RAO, ST ^{[1
]}

WEIL, R ^{[1
]}

机构：

[1] STEVENS INST TECHNOL,DEPT MAT & MET ENGN,HOBOKEN,NJ 07030

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1980年 / 127卷 / 05期

关键词：

D O I：

10.1149/1.2129811

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1030 / 1034

页数：5

共 15 条

[1]

DICKSON EW, 1965, PHILOS MAG, V4, P575

[2]

FEIGENBAUM H, 1979, PLAT SURF FINISH, V66, P64

[3] SURFACE-STRESS PHENOMENA AT THE START OF EPITAXIAL ELECTRODEPOSITION OF NICKEL [J].

FEIGENBAUM, H ;

WEIL, R .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (12) :2085-2090

[4] STRESSES IN THIN-FILMS - RELEVANCE OF GRAIN-BOUNDARIES AND IMPURITIES [J].

HOFFMAN, RW .

THIN SOLID FILMS, 1976, 34 (02) :185-190

[5]

Klockholm E., 1969, REV SCI INSTRUM, V40, P1054

[6] EFFECT OF COHERENCY STRAIN AND MISFIT DISLOCATIONS ON MODE OF GROWTH OF THIN-FILMS [J].

MATTHEWS, JW ;

JACKSON, DC ;

CHAMBERS, A .

THIN SOLID FILMS, 1975, 26 (01) :129-134

[7] INITIAL STAGES OF ELECTROMONOCRYSTALLIZATION OF NICKEL ON COPPER-FILM SUBSTRATES [J].

NAKAHARA, S ;

WEIL, R .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (11) :1462-1469

[8]

RAGHUNATHAN K, 1979, THESIS STEVENS I TEC

[9]

RAO ST, 1979, T I MET FINISH, V53, P97

[10]

Souzis L., 1976, Surface Technology, V4, P41, DOI 10.1016/0376-4583(76)90016-9

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