CORRELATION BETWEEN DIELECTRIC AND CHEMORHEOLOGICAL PROPERTIES DURING CURE OF EPOXY-BASED COMPOSITES

被引：58

作者：

MAFFEZZOLI, A

TRIVISANO, A

OPALICKI, M

MIJOVIC, J

KENNY, JM

机构：

[1] UNIV NAPLES,DEPT MAT & PROD ENGN,I-80125 NAPLES,ITALY

[2] POLYTECH INST NEW YORK,DEPT CHEM ENG,BROOKLYN,NY 11201

[3] UNIV PERUGIA,CTR MAT ENGN,I-05100 TERNI,ITALY

来源：

JOURNAL OF MATERIALS SCIENCE | 1994年 / 29卷 / 03期

关键词：

D O I：

10.1007/BF00445996

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A method for the complete thermal, rheological and dielectric characterization of an epoxy matrix for advanced composites is presented. The analysis of the dielectric response suggests that ionic resistivity data can be used to develop quantitative correlations with the materials properties during thermosets processing. Ionic resistivity and degree of reaction data are correlated during the cure of the studied epoxy matrix and good agreement between the model predictions and the experimental data is observed under isothermal and non-isothermal conditions. Moreover, degree of reaction data calculated from dielectric measurements are used in a chemorheological model for viscosity calculation, obtaining very good correlation between measured and predicted viscosity.

引用

页码：800 / 808

页数：9

共 29 条

[1]

[Anonymous], 1980, VISCOELASTIC PROPERT

[2]

BERGLUND LA, 1991, SAMPE J, V27, P27

[3] DIELECTRIC ANALYSIS OF THE CURE OF THERMOSETTING EPOXY AMINE SYSTEMS [J].