ANALYSIS AND DESIGN-DATA FOR ADHESIVELY BONDED JOINTS

被引:30
作者
JEANDRAU, JP
机构
关键词
ADHESIVE-BONDED JOINTS; STRESS ANALYSIS; ANALYTICAL METHODS; FINITE ELEMENT METHOD; ADHESIVE PROPERTIES; COMPUTER SOFTWARE;
D O I
10.1016/0143-7496(91)90029-H
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Software based on published analytical methods and implemented on an IBM PC microcomputer enables the engineer to determine the stress distribution and to design adhesively bonded joints of simple configurations. For complex configurations the finite element software CA.ST.OR 2D can be used. In this paper, methods and specimens enabling the determination of the mechanical characteristics of interest to the designer are reviewed and described. These mechanical properties can be obtained on the bulk adhesive (in tension and compression) or on adhesively bonded joints in shear (thick adherend specimens). Results obtained on five epoxy-based structural adhesives are presented. The validity of both the design software and the mechanical test methods is proven experimentally using adhesively bonded single lap joints.
引用
收藏
页码:71 / 79
页数:9
相关论文
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