TERMINATION MATERIALS FOR THIN FILM RESISTORS

被引：21

作者：

FISHER, JS

HALL, PM

机构：

来源：

PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS | 1971年 / 59卷 / 10期

关键词：

D O I：

10.1109/PROC.1971.8448

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1418 / &

共 8 条

[1] CASTRO PS, 1961, ELECTRON ENG, V80, P535
[2] CUNNINGHAM JA, 1970 IEEE INT EL DEV, P50
[3] FISHER JS, 1968 P IEEE EL COMP, P299
[4] EVALUATION OF INTERFACIAL RESISTANCE OF THIN FILM INTERCONNEXIONS
GALLA, RT
GREENHOU.HM
VERGARA, WC
[J]. MICROELECTRONICS RELIABILITY, 1968, 7 (03) : 185 - &
[5] ADHESION MECHANISM OF GOLD-UNDERLAYER FILM COMBINATIONS TO OXIDE SUBSTRATES
HAQ, KE
BEHRNDT, KH
KOBIN, I
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (01): : 148 - &
[6] HUGHES VC, AD850084
[7] HUGHES VC, 1969, NAFITR1369 ASTIA REP
[8] WILSON RW, 1970, ELECTRONIC PACKAGI 2, pMC29