IMPROVED ADHESION OF CVD DIAMOND FILMS TO STEEL AND WC-CO SUBSTRATES

被引：27

作者：

NESLADEK, M

SPINNEWYN, J

ASINARI, C

LEBOUT, R

LORENT, R

机构：

[1] Diamant Boart, B-1190 Brussels, Av. Pont de Luttre

来源：

关键词：

D O I：

10.1016/0925-9635(94)90038-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A stress relief multilayer (SRM) structure to improve the adhesion of chemical vapour deposition (CVD) diamond films to steel and WC-Co substrates is described. This structure contains silver as a stress-relaxing layer and a refractory metal (RM) layer as a diamond-bonding layer. Raman analysis shows that the thermal stress in diamond films deposited on steel and WC-Co substrates coated with SRM structures is relaxed after a thermal treatment, performed during the last stage of the CVD. The results of tests of diamond film adhesion to the SRM structures are presented. An X-ray investigation of the diamond-RM bonding interface shows where adhesion failure occurs.

引用

页码：98 / 104

页数：7

共 13 条

[1]

BOYER HE, 1991, METALS HDB

[2]

GIGL PD, 1990, 0402671 PUBL

[3]

JOFFREAU PO, 1988, J REF HARD METALS, V7, P92

[4]

JOFFREAU PO, 1988, J REF HARD METALS, V7, P186