EQUIVALENT-CIRCUIT MODELING OF INTERCONNECTS FROM TIME-DOMAIN MEASUREMENTS

被引:33
作者
JONG, JM
JANKO, B
TRIPATHI, V
机构
[1] TEKTRONIX INC,BEAVERTON,OR 97077
[2] OREGON STATE UNIV,DEPT ELECT ENGN,CORVALLIS,OR 97330
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1993年 / 16卷 / 01期
关键词
D O I
10.1109/33.214868
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A technique for the equivalent circuit modeling of single and coupled uniform and nonuniform interconnects, including discontinuities such as bends and junctions in high-speed circuits and packages, is presented. The circuit models are extracted from time-domain reflection and transmission measurement (TDR/T). The SPICE simulated results for the extracted circuit models for typical single and coupled structures are compared with the measured data to validate the accuracy of the circuit models.
引用
收藏
页码:119 / 126
页数:8
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