THE DESIGN OF THE ES/9000 MODULE

The new ES/9000 thermal conduction module (TCM) is a significant improvement over the TCM's used in the current IBM 3090 series of mainframes. Included in the features of this new module, which supports an order of magnitude increase in usable circuits, are a glass ceramic substrate material, buried engineering change wires, partial thin film redistribution, and on-module decoupling capacitors. A description of the physical attributes and the electrical design considerations will be given. The result is a packaged electronic technology that supports approximately a two times faster machine cycle time than the original 3090 technology.