SELF-ALIGNED FLIP-CHIP ASSEMBLY OF PHOTONIC DEVICES WITH ELECTRICAL AND OPTICAL CONNECTIONS

A new technique is discussed which offers major advantages in performance, ruggedness, and cost in the interfacing of integrated optical circuits. Based on a self-aligned flip-chip solder bump bonding process, the technique achieves ∼ 1-µm accuracy in optical fiber placement without requiring micromanipulation of piece parts during final assembly. A high density of electrical interconnections is achieved simultaneously with the optical fiber connections. © 1990 IEEE