MECHANICS OF SINTERING THIN-FILMS .2. CRACKING DUE TO SELF-STRESS

被引：45

作者：

JAGOTA, A

HUI, CY

机构：

[1] E.I. DuPont de Nemours and Co., Wilmington, DE 19880

[2] Department of Theoretical and Applied Mechanics, Cornell University, Ithaca

来源：

MECHANICS OF MATERIALS | 1991年 / 11卷 / 03期

关键词：

D O I：

10.1016/0167-6636(91)90004-J

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The mechanics of cracks in thin films is examined in this paper, the second part of a study of sintering thin films constrained by a substrate. The film is analyzed as a compressible viscous fluid with a sliding interface between film and substrate. The analysis can be applied to elastic films with a weak interface due to the mathematical analogy between linear viscous and linear elastic deformations. Asymptotic expressions for the stress intensity factor of a crack in an infinite film are derived for the limiting cases of low and high interfacial friction. These asymptotic results are verified by finite element computations which also provide numerical results for intermediate values of friction. It is assumed that the crack will grow if the stress intensity is large enough that the contact area of particles just ahead of the crack tip decreases. Expressions for the stress intensity factor are used with this fracture criterion to predict conditions for crack growth and initiation in sintering thin films. An interesting result is that for sintering films it is possible to predict conditions for crack growth in terms of geometrical factors alone, such as film thickness, friction, and crack size.

引用

页码：221 / 234

页数：14

共 18 条

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