MODELING OF POSITIVE-TONE SILYLATION PROCESSES FOR 193-NM LITHOGRAPHY

被引:13
作者
HARTNEY, MA
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1993年 / 11卷 / 03期
关键词
D O I
10.1116/1.586818
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A modeling approach is presented for positive-tone silylation processes. By reducing the effect of crosslinking on diffusion of the silylating agent to a characteristic curve, the silylation profiles can be determined from aerial images. Comparisons are made to experimental profiles obtained using a scanning electron microscope and selective staining methods. Deviations from the model are observed as a function of both feature size and feature type. These discrepancies are consistent with a swelling limitation imposed by the cross-linking. By combining an anisotropic etching model with the silylation profiles, the final linewidths can be predicted as a function of dose, selectivity, and overetch.
引用
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页码:681 / 687
页数:7
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